Combined transmitted and reflected light imaging of internal cracks in semiconductor devices

A first light source is directed at an outer surface of the workpiece in the inspection module. Light reflected from the outer surface of the workpiece from the first light source is directed to a camera via a first path. Light from the first light source transmitted through the workpiece is directed to the camera via a second path. A second light source is directed at the outer surface of the workpiece at 180 DEG from the light of the first light source. Light reflected from the outer surface of the workpiece from the second light source is directed to the camera via the second path. Light transmitted through the workpiece from the second light source is directed to the camera via the first path. 在检验模块中将第一光源引导于工件的外表面处。经由第一路径将来自所述第一光源的从所述工件的所述外表面反射的光引导到相机。经由第二路径将来自所述第一光源的透射穿过所述工件的光引导到所述相机。将第二光源引导于所述工件的所述外表面处，与所述第一光源的光成180°。经由所述第二路径将来自所述第二光源的从所述工件的所述外表面反射的光引导到所述相机。经由所述第一路径将来自所述第二光源的透射穿过所述工件的光引导到所述相机。