LED lamp bead packaging method and LED lamp bead
The invention discloses a packaging method of an LED lamp bead and the LED lamp bead. The packaging process comprises the following steps: step 1, cleaning a bracket; step 2, fixing a chip; step 3, baking to solidify the silver colloid; step 4, carrying out plasma cleaning on the bracket; 5, welding...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a packaging method of an LED lamp bead and the LED lamp bead. The packaging process comprises the following steps: step 1, cleaning a bracket; step 2, fixing a chip; step 3, baking to solidify the silver colloid; step 4, carrying out plasma cleaning on the bracket; 5, welding a bonding wire to enable the bonding wire to be communicated with the positive electrode and the negative electrode of the chip; sixthly, a bridging agent is sprayed on the surface of the support; 7, silica gel is injected on the support; and step 8, baking. Compared with the prior art, the LED packaging technology can provide great guarantee for the product quality of the LED lamp beads, meanwhile, the operability of the production technology is optimized, the quality of the LED lamp products manufactured through the technology is more excellent, the high-end characteristics of the products and the quality guarantee of the vehicle gauge level are better met, and the LED lamp packaging technology is suitable for l |
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