Disc loading mode and side face polishing method for cementing layer metal film plating assembly

The invention discloses a disc feeding mode and a side surface polishing method of a cementing layer metal film plating assembly, which are mainly embodied in a side surface disc feeding mode and an infiltration type polishing method. The polishing device comprises an optical cement plate, an import...

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Bibliographische Detailangaben
Hauptverfasser: ZHU YICUN, CHEN WEI, LIAO HONGPING, FU XIANGHUI, SHI BAOSHUI, CHEN QIUHUA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a disc feeding mode and a side surface polishing method of a cementing layer metal film plating assembly, which are mainly embodied in a side surface disc feeding mode and an infiltration type polishing method. The polishing device comprises an optical cement plate, an imported double-sided 3M adhesive tape, a water storage type polishing disc, a polishing pad and a cementing layer plated metal film assembly product with the side face to be polished. The polishing machine is characterized in that a side surface tray feeding mode is different from a cold glue tray feeding mode and a hot glue tray feeding mode, a product does not need to be heated or refrigerated, the side surface is adhered by adopting an imported double-sided 3M adhesive tape and is fixed on an optical cement plate, and then the whole polishing machine is soaked on a water storage type polishing disk filled with polishing liquid for circular polishing. The method has the advantages that the disc feeding operation is si