Manufacturing method of high-capacity circuit breaker heat dissipation structure
The invention discloses a manufacturing method of a heat dissipation structure of a high-capacity circuit breaker, and the method comprises the steps: providing a conductive cylinder of the high-capacity circuit breaker, enabling the short-circuit current peak value of the high-capacity circuit brea...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a manufacturing method of a heat dissipation structure of a high-capacity circuit breaker, and the method comprises the steps: providing a conductive cylinder of the high-capacity circuit breaker, enabling the short-circuit current peak value of the high-capacity circuit breaker to reach hundreds of kiloamperes and above, taking the outer surface of the conductive cylinder as a base layer, and constructing a three-dimensional model of the heat dissipation structure, the three-dimensional model comprises a plurality of heat dissipation units extending in multiple directions from the base layer, each heat dissipation unit comprises a thin and long structure, layering is carried out based on the three-dimensional model, a path is planned, and layer-by-layer stacking is carried out on the base layer based on the path so that the heat dissipation structure can be manufactured in an additive mode.
公开了大容量断路器散热结构的制造方法,方法中,提供大容量断路器的导电圆筒,所述大容量断路器为其短路电流峰值达到数百千安级及以上,将所述导电圆筒外表面作为基层,构建散热结构的三维模型,所述三维 |
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