Formula and preparation method of black fungus composite crisp chips

The invention provides a black fungus composite crisp chip formula, which contains black fungus, Chinese yam, coix seed, potato and red bean. The invention also provides a preparation method of the black fungus composite crisp chip. The preparation method comprises the following steps: (1) grinding...

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Bibliographische Detailangaben
Hauptverfasser:	DUAN ZHENHUA, KONG XIANGHUI, LI DINGJIN, DUAN WEIWEN, TANG XIAOXIAN, REN AIQING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	FOODS OR FOODSTUFFS FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BYSUBCLASSES A23B - A23J HUMAN NECESSITIES PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL SHAPING OR WORKING OF FOODSTUFFS, NOT FULLY COVERED BY ASINGLE OTHER SUBCLASS THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OFNUTRITIVE QUALITIES, PHYSICAL TREATMENT THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
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Beschreibung
Zusammenfassung:	The invention provides a black fungus composite crisp chip formula, which contains black fungus, Chinese yam, coix seed, potato and red bean. The invention also provides a preparation method of the black fungus composite crisp chip. The preparation method comprises the following steps: (1) grinding into paste; (2) preparing a flavoring agent; (3) compounding; (4) quick-freezing; (5) vacuum microwave freezing and pre-drying; (6) puffing; (7) vacuum microwave drying; and (8) cooling and packaging. 本发明提供了一种黑木耳复合脆片配方，配方含有黑木耳、山药、薏苡仁、马铃薯，还包括赤小豆。本发明还提供了黑木耳复合脆片的制备方法，包括以下步骤：(1)研泥；(2)调味剂制备；(3)复配；(4)速冻；(5)真空微波冷冻预干燥；(6)膨化；(7)真空微波干燥；(8)冷却、包装。