Bonding device and bonding method

A joining device (41) according to an embodiment is provided with holding sections (111, 211), deformation sections (114, 213), and a control section (70a). The holding parts (111, 211) hold the substrates (W1, W2) to be bonded. The deformation sections (114, 213) project the central sections of the substrates (W1, W2) held by the holding sections (111, 211) relative to the outer peripheral sections of the substrates (W1, W2). On the basis of at least one of the thickness of the substrates (W1, W2), the temperature of the substrates (W1, W2), and the warpage of the substrates (W1, W2) in a state in which the substrates (W1, W2) are not held by the holding units (111, 211), the control unit (70a) adjusts the amount by which the substrates (W1, W2) protrude by the deformation units (114, 213) for each of the substrates (W1, W2). 实施方式所涉及的接合装置(41)具备保持部(111、211)、变形部(114、213)以及控制部(70a)。保持部(111、211)保持要被接合的基板(W1、W2)。变形部(114、213)使被保持于保持部(111、211)的基板(W1、W2)的中央部相对于基板(W1、W2)的外周部突出。控制部(70a)基于基板(W1、W2)的厚度、基板(W1、W2)的温度以及未被保