Blind hole-based HDI circuit board manufacturing method and HDI circuit board

The invention provides a blind hole-based HDI circuit board manufacturing method and an HDI circuit board. The blind hole-based HDI circuit board manufacturing method comprises the following steps of: manufacturing a jig plate; forming a plurality of mounting holes distributed at intervals in the jig plate; providing a plurality of flexible top nails; the multiple flexible top nails are installed in the multiple installation holes of the jig plate in a one-to-one correspondence mode; fixing the jig plate on a plug hole printing table; providing a plurality of substrates; each substrate is plugged with a flexible top nail through a jig plate on the plug hole printing table board, so that the plug hole of each substrate is filled with the corresponding flexible top nail; performing line forming operation on each substrate; and taking out the corresponding flexible top nail for each substrate, and aligning the plug holes of each substrate. Compared with a traditional steel nail, the quality problems that the ste