Substrate processing method and substrate processing apparatus

The invention provides a substrate processing method and a substrate processing apparatus, which are used for forming a processing film with more uniform film thickness at the periphery of a substrate. A substrate processing method for forming a processing film on a peripheral portion of a surface of a substrate includes: supplying a processing liquid for forming the processing film to the peripheral portion; and bringing the forming solvent, which is supplied to a region on the inner side of the region to which the processing liquid is supplied, of the surface of the substrate into contact with a boundary on the center side of the substrate of the processing liquid supplied to the peripheral portion. 本发明提供一种基板处理方法和基板处理装置，用于在基板的周缘部形成膜厚更均匀的处理膜。对基板表面的周缘部形成处理膜的基板处理方法包括：向所述周缘部供给用于形成所述处理膜的处理液；以及使被供给到所述基板表面中的比被供给了所述处理液的区域更靠内侧的区域的成形用溶剂与被供给到所述周缘部的所述处理液的靠所述基板的中央侧的边界接触。