CONTROL DEVICE, LASER MACHINING SYSTEM PROVIDED WITH SAME, AND LASER MACHINING METHOD

A control device (10) is provided with a machining control unit (11), an image processing unit (12), and a storage unit (13). The storage unit (13) stores: a registration pattern (RP) that is set in a state where a workpiece (50) is at a reference position and at a reference height and that includes...

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Bibliographische Detailangaben
Hauptverfasser: ISHIZU YUICHI, FUKUI HIROSHI, OUE HIROSHI, KISAICHI KOJI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A control device (10) is provided with a machining control unit (11), an image processing unit (12), and a storage unit (13). The storage unit (13) stores: a registration pattern (RP) that is set in a state where a workpiece (50) is at a reference position and at a reference height and that includes the shape of a part of the workpiece (50); a subject reference position (P0, Q0) corresponding to the registration pattern (RP); and reference coordinates (X0, Y0) of a position at which the workpiece (50) irradiated with a guide beam is present. The machining control unit (11) corrects a laser beam machining position on a machining surface (50c) of the workpiece (50) with reference to the reference coordinates (X0, Y0) stored in the storage unit (13) and the subject reference position (P0, Q0) corresponding to the registration pattern (RP). 控制装置(10)具备加工控制部(11)、图像处理部(12)以及存储部(13)。存储部(13)保存在工件(50)位于基准位置及基准高度的状态下设定的、包括工件(50)的一部分形状在内的登记图案(RP)、与该登记图案对应的对象基准位置(P0,Q0)、以及被照射到导向光的工件(50)所存在的位置的基准坐标(X0,Y0)。加工控制部(11)参照在存储部(1