Micromechanical filter with zeroing mode structure

The invention provides a micromechanical filter with zeroingmode structure, and belongs to the technical field of semiconductor packaging. The filter comprises an upper dielectric layer and a lower dielectric layer, the upper dielectric layer is provided with an upper layer grounding metalized throu...

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Hauptverfasser: YUE XIAOPING, WANG SHENGFU, ZHOU MINGQI, ZHU YIFAN, ZHANG JUNJIE, WEN PENGHAO, QI MINGYAN, LI HONGJUN, ZHOU SHAOBO, YU LIANG, WANG XIAOWEI, TANG XIAODONG, WANG XIAOLONG, ZHANG SHAOHUA, SUN TAO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a micromechanical filter with zeroingmode structure, and belongs to the technical field of semiconductor packaging. The filter comprises an upper dielectric layer and a lower dielectric layer, the upper dielectric layer is provided with an upper layer grounding metalized through hole, a signal feed-in part and a signal feed-out part; the lower dielectric layer is bonded to the lower surface of the upper dielectric layer, the lower dielectric layer is provided with a lower layer grounding metalized through hole and a lower layer electromagnetic shielding metalized through hole, and the lower layer electromagnetic shielding metalized through hole serves as a zeroing mode resonant column; the signal feed-in part and the signal feed-out part do not physically communicate with the zeroing mode resonant column; and the upper dielectric layer and the lower dielectric layer realize common ground through the upper layer grounding metalized through hole and the lower layer grounding metalized thr