Wafer splitting method, wafer splitting device, wafer splitting equipment and storage medium

The invention discloses a wafer splitting method, a wafer splitting device, wafer splitting equipment and a storage medium. The wafer splitting method comprises the following steps: acquiring distribution data of all parting lines on a wafer; dividing all the segmentation lines on the wafer into a plurality of partitions; setting a splitting mode of each partition according to the characteristics of the wafer; and sending the splitting mode to execution equipment, so that the execution equipment splits the wafer according to the splitting mode. According to the method, the cutting lines on the surface of the wafer are partitioned, the cleaver only splits the cutting lines in a single partition in the splitting process of each partition, the splitting direction and the splitting sequence of each partition can be preferentially selected according to the process effect; in other words, the wafer is firstly divided into smaller units; so that accumulated extrusion deformation generated during splitting is reduced