TESTING PROBE SYSTEM FOR TESTING SEMICONDUCTOR DIE, MULTI-CHANNEL DIE HAVING SHARED PADS, AND RELATED SYSTEMS AND METHODS

A testing probe system for testing a semiconductor die, a multi-channel die having shared pads, and related systems and methods. The testing probe system includes probes configured to contact shared probe pads of multi-channel die of a wafer; and a controller configured to generate testing patterns and receive signals from the multi-channel die of the wafer. The controller is configured to contact a probe of the probes with a shared probe pad of the multi-channel die, select a first channel of the multi-channel die to test, select at least one test mode for testing the first channel, stimulate at least the first channel during a single contact period, acquiring a first output of the first channel during the single contact period, select a second channel of the multi-channel die to test, select at least one test mode for testing the second channel, stimulate at least the second channel during the single contact period, and acquire a second output of the first channel during the single contact period. 本申请案涉及用于测