Component mounting device and component warpage detection method

The present invention can improve the robustness of ball height measurement and component warpage measurement of a ball component, thereby more accurately determining whether the ball component is a defective component. A component mounting device includes: an imaging unit that images, from a plurality of different directions, a plurality of balls provided on a lower surface of a component held by a mounting head; a defective ball determination unit that determines whether or not each of the plurality of balls is a defective ball on the basis of each of a plurality of captured images captured from the plurality of different directions by the imaging unit; a ball height measurement unit that measures the height of each ball that is not determined as a defective ball by the defective ball determination unit; and a component warpage detection unit that detects warpage of the component on the basis of the height of each ball measured by the ball height measurement unit. 本发明能够提高球部件的球高计测以及部件翘曲计测的鲁棒性，从而更准确地判定球部件是否为不