Full-automatic pressure curing equipment for semiconductor packaging

The invention discloses full-automatic pressure curing equipment for semiconductor packaging. The full-automatic pressure curing equipment comprises a high-temperature pressure furnace and a conveying mechanism, the high-temperature pressure furnace comprises a base (101), a furnace body (103) is fixedly installed on the base (101) through a rear support (102), a furnace cover (105) used for sealing the open end of one side of the furnace body is installed on the base (101) through a front support (104), a bracket (106) is installed in the furnace body (103) in a sliding mode, one end of the bracket (106) is fixedly installed on the furnace cover (105), and the bracket (106) is pulled out of the furnace body (103) through the furnace cover (105). Compared with the prior art, the automatic continuous production of the high-temperature pressure furnace is achieved, and the temperature uniformity problem of the lengthened high-temperature pressure furnace is solved by arranging the fan motor on the side face of