Self-adaptive parallel sealing and welding mechanism for microelectronic packaging in high vacuum state

The invention discloses a self-adaptive parallel sealing and welding mechanism for microelectronic packaging in a high vacuum state, and solves the problem of how to complete high-quality parallel sealing and welding of a cover plate and a tube shell of a thin-shell device in a vacuum environment at low cost so as to improve the sealing and welding yield. The self-adaptive parallel sealing and welding mechanism is characterized in that a floating parallel welding wheel support is arranged, two parallel welding wheels on the support are pressed on parallel welding seams between a cover plate and a tube shell in a floating mode, weights are arranged at the top end of the parallel welding wheel support, and the welding pressure of the parallel welding wheels on the welding seams is adjusted by increasing or reducing the number of the weights, so that the adjustment of the self-adaptive welding pressure in the welding process is realized; and a shoulder-pole-shaped semi-square-shaped jacking frame body is arrange