Fabrication method using angled deposition and shadow walls

A method of fabricating a device (12), comprises: forming portions of electronic circuitry and a shadow wall structure (13) over a substrate, and then depositing a conducting layer (5) over the substrate in at least a first deposition direction at an acute angle relative to the plane of the substrate. The shadow wall structure is arranged to cast a shadow in the deposition, leaving areas where the conducting material is not deposited. The shadow wall structure comprises one or more gaps (15) each shorter than a shadow length of a respective part of the shadow wall structure casting the shadow into the gap, to prevent the conducting material forming in the gaps and to thereby create regions of the upper conducting layer that are electrically isolated from one another. These are arranged to form conducting elements for applying signals to, and/or receiving signals from, the electronic circuitry. 一种制造设备(12)的方法，该方法包括：在基板上方形成电子电路装置的部分和阴影壁结构(13)，并且然后通过在以相对于基板平面成锐角的至少第一沉积方向上沉积导电材料，在基板上沉积导电层(5)。阴影壁结构被布置成在沉积中投下阴影，以留下导