SURFACE TREATMENT APPARATUS AND METHOD FOR SURFACE TREATMENT OF PATTERNING DEVICES AND OTHER SUBSTRATES

Disclosed are a surface treatment apparatus and method for surface treatment of substrates such as wafers or substrates. The surface treatment apparatus comprises one or more support structures for supporting one or more substrates and one or more ultraviolet illumination sources configured to emit ultraviolet illumination, and being operable to treat said at least one surface of said one or more substrates while said one or more substrates being supported by said one or more support structures. The one or more ultraviolet illumination sources are distinct from an exposure source and not operable to emit exposure illumination for exposing a pattern on a wafer. 公开了一种表面处理设备和方法，用于对诸如晶片或基板的衬底进行表面处理。该表面处理设备包括一个或多个支撑结构，用于支撑一个或多个衬底，以及一个或多个紫外照明源，被配置为发射紫外照明，并且可操作地处理所述一个或多个衬底的所述至少一个表面，同时所述一个或多个衬底由所述一个或多个支撑结构支撑。一个或多个紫外照明源与曝光源不同，并且不可操作为发射用于曝光晶片上的图案的曝光照明。