SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE OF SEMICONDUCTOR DEVICE

This disclosure relates to a semiconductor device comprising a first n+ region, a first p+ region within the first n+ region, a second n+ region, a second p+ region, positioned between the first n+ region and the second n+ region. The first n+ region, the second n+ region and the second p+ region ar...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: UTZIG JOACHIM, VADDAGERE NAGARAJU VASANTHA KUMAR, NOTERMANS GUIDO, HANS-MARTIN RITTER, HOLLAND STEFFEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This disclosure relates to a semiconductor device comprising a first n+ region, a first p+ region within the first n+ region, a second n+ region, a second p+ region, positioned between the first n+ region and the second n+ region. The first n+ region, the second n+ region and the second p+ region are positioned within a p- region. A first space charge region and a second space charge region are formed within the p- region. The first space region is positioned between the first n+ region and the second p+ region, and the second space region is positioned between the second p+ region and the second n+ region. 本公开涉及一种半导体装置,包括:第一n+区域;第一p+区域,其位于第一n+区域内;第二n+区域;第二p+区域,其位于第一n+区域与第二n+区域之间。第一n+区域、第二n+区域和第二p+区域位于p-区域内。第一空间电荷区域和第二空间电荷区域形成在p-区域内。第一空间区域位于第一n+区域与第二p+区域之间,第二空间区域位于第二p+区域与第二n+区域之间。