Method for bonding middle frame and to-be-bonded piece of mobile terminal

The invention belongs to the field of adhesives, and relates to a method for bonding a middle frame and a to-be-bonded piece of a mobile terminal. The method comprises the following steps of: pasting foam adhesive; fitting the to-be-bonded piece; pre-pressing and activating the foam adhesive; dispen...

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Bibliographische Detailangaben
Hauptverfasser: CAO YANG, ZHENG MIAO, XU XUNFU, LIU TAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the field of adhesives, and relates to a method for bonding a middle frame and a to-be-bonded piece of a mobile terminal. The method comprises the following steps of: pasting foam adhesive; fitting the to-be-bonded piece; pre-pressing and activating the foam adhesive; dispensing the adhesive; carrying out primary UV illumination curing; wiping the adhesive; carrying out secondary UV illumination curing and carrying out moisture curing. According to the method provided by the invention, the width of a gap is not limited, the beneficial effects of no layering separation, no crack and good appearance can be realized, and the gap between the middle frame and the to-be-bonded piece can be perfectly filled. 本发明属于胶黏剂领域,涉及一种用于粘接移动终端的中框与待粘接件的方法,该方法包括贴泡棉胶、贴合待粘接件、预压激活泡棉胶、点胶、第一次UV光照固化、擦胶、第二次UV光照固化和湿气固化。本发明提供的方法对缝隙宽度无限制且能够实现无分层脱离、无裂缝、外观佳的有益效果,能够对中框与待粘接件之间的缝隙进行完美填充。