Processing method of frame body, frame body and electronic equipment

The embodiment of the invention provides a processing method of a frame body, the frame body and electronic equipment. The processing method specifically comprises the following steps: carrying out injection molding by adopting a plastic material to obtain a frame body; carrying out laser etching on the frame body by adopting a laser direct forming technology to form a concave antenna circuit; preparing a conductive layer embedded in the antenna circuit on the frame body so as to form an antenna on the frame body; and spraying a paint layer on the surfaces of the frame body and the antenna to obtain the frame. According to the embodiment of the invention, the mechanical performance of the frame body is excellent, and the layout flexibility of the antenna on the frame body can be improved. 本申请实施例提供了一种框体的加工方法、框体及电子设备。所述加工方法具体包括：采用塑胶材料注塑成型，以得到框体本体；采用激光直接成型技术在所述框体本体上镭雕出凹陷的天线线路；在所述框体本体上制备嵌设于所述天线线路的导电层，以在所述框体本体上形成天线；在所述框体本体和所述天线的表面喷涂油漆层，以得到所述框体。本申请实施例中，所述框体本体的机械性能较优，而且，还可以提高天线在所述框体本体上的布局灵活性。