Heat dissipation device for electronic component

The invention belongs to the technical field of radiators and relates to a heat dissipation device for an electronic component. The heat dissipation device comprises a top plate and a bottom plate; the top plate and the bottom plate are hollow; a plurality of first pipes are arranged between the top plate and the bottom plate in a communicated manner; a first liquid pipe for adding phase change liquid is arranged on the bottom plate; the first liquid pipe is communicated with the bottom plate; the vertical side walls of the top plate and the bottom plate are jointly connected with a heat dissipation box; a heat dissipation opening is formed in one side wall of the heat dissipation shell; the multiple first pipes shield the heat dissipation opening; a fan is arranged in the heat dissipation box and faces the heat dissipation opening; and a cooling assembly used for cooling air blown out by the fan is arranged on the heat dissipation box. According to the heat dissipation device of the invention, the electronic