Method for removing copper from PCB through etching processing
The invention discloses a method for removing copper from a PCB through etching processing. The method comprises the following steps of: S1, performing yield detection, specifically, determining the yield of first workpieces in mass production, and detecting whether residual copper or convex copper...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for removing copper from a PCB through etching processing. The method comprises the following steps of: S1, performing yield detection, specifically, determining the yield of first workpieces in mass production, and detecting whether residual copper or convex copper exists or not; S2, performing dropping liquid preparation, specifically, determining the concentration of a copper-removing dropping liquid and preparing the copper-removing dropping liquid according to a detection result of S1; S3, performing step setting, specifically, setting the step of the copper-removing dropping liquid after the step of developing and before the step of etching; and S4, performing etching treatment, specifically, sequentially carrying out developing, copper removal, etching and film stripping treatment on an exposed PCB, and detecting the yield of the first workpiece again. According to the method of the invention, a water washing tank body is fixed after developing to prepare the copper-rem |
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