Three-dimensional board-level fan-out type packaging structure and manufacturing method thereof

The invention discloses a three-dimensional board-level fan-out type packaging structure and a manufacturing method thereof. The manufacturing method comprises the steps of respectively bonding copper foils on the front surface and the back surface of a carrier piece, and forming a composite carrier plate; manufacturing a conductive structure on the composite carrier plate; manufacturing conductive salient points on a bonding pad of a chip I; mounting the chip I on the composite carrier plate; forming a plastic package layer wrapping the conductive structure and the chip I on the composite carrier plate; respectively manufacturing a rewiring layer and an insulating dielectric layer on the surface of the plastic package layer; removing the carrier piece to obtain a packaged semi-finished product structure; respectively manufacturing a rewiring layer and an insulating dielectric layer on the back surface of the chip I for packaging the semi-finished product structure; manufacturing a signal leading-out structur