Chemical copper plating photocuring activated ink and preparation method thereof, and preparation method of addition circuit board
The invention provides chemical copper plating photocuring activated ink and a preparation method thereof, and a preparation method of an addition circuit board, wherein the chemical copper plating photocuring activated ink comprises an organic solvent, and a carbon-supported metal nano composite ma...
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| creator | DING PING LIN CHANGLIN SHI XIYAN FU XIANZHU LUO SHILONG |
| description | The invention provides chemical copper plating photocuring activated ink and a preparation method thereof, and a preparation method of an addition circuit board, wherein the chemical copper plating photocuring activated ink comprises an organic solvent, and a carbon-supported metal nano composite material, a prepolymer monomer, an active diluent monomer, a photoinitiator and an auxiliary agent dissolved in the organic solvent; the carbon-supported metal nano composite material is composed of carbon black and a metal nano particle catalyst. The chemical copper plating photocuring activated ink prepared by the invention is uniform and stable slurry, and still keeps the original state after being sealed and stored for one month at room temperature; secondly, the chemical copper plating photocuring activated ink can achieve a complete curing effect within several seconds under an ultraviolet lamp illumination condition, so that the production efficiency is greatly improved; finally, the electroless copper-plating |
| format | Patent |
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The chemical copper plating photocuring activated ink prepared by the invention is uniform and stable slurry, and still keeps the original state after being sealed and stored for one month at room temperature; secondly, the chemical copper plating photocuring activated ink can achieve a complete curing effect within several seconds under an ultraviolet lamp illumination condition, so that the production efficiency is greatly improved; finally, the electroless copper-plating</description><language>chi ; eng</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220208&DB=EPODOC&CC=CN&NR=114015278A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220208&DB=EPODOC&CC=CN&NR=114015278A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DING PING</creatorcontrib><creatorcontrib>LIN CHANGLIN</creatorcontrib><creatorcontrib>SHI XIYAN</creatorcontrib><creatorcontrib>FU XIANZHU</creatorcontrib><creatorcontrib>LUO SHILONG</creatorcontrib><title>Chemical copper plating photocuring activated ink and preparation method thereof, and preparation method of addition circuit board</title><description>The invention provides chemical copper plating photocuring activated ink and a preparation method thereof, and a preparation method of an addition circuit board, wherein the chemical copper plating photocuring activated ink comprises an organic solvent, and a carbon-supported metal nano composite material, a prepolymer monomer, an active diluent monomer, a photoinitiator and an auxiliary agent dissolved in the organic solvent; the carbon-supported metal nano composite material is composed of carbon black and a metal nano particle catalyst. The chemical copper plating photocuring activated ink prepared by the invention is uniform and stable slurry, and still keeps the original state after being sealed and stored for one month at room temperature; secondly, the chemical copper plating photocuring activated ink can achieve a complete curing effect within several seconds under an ultraviolet lamp illumination condition, so that the production efficiency is greatly improved; finally, the electroless copper-plating</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirsKwkAQRdNYiPoPY69gfKCtBMXKyj6Mu5PsYLIzbCZ-gF_uA1vB6lzOPcPsUQRq2WEDTlQpgTZoHGvQICauT--NzviORh443gCjB02kmF6lRGjJgniwQImkmv36pQL0nj_KcXI9G1wFkx9ngwqbjiZfjrLp8XApTnNSKalTdBTJyuKc5-tFvllud_vVP80TOJtKgQ</recordid><startdate>20220208</startdate><enddate>20220208</enddate><creator>DING PING</creator><creator>LIN CHANGLIN</creator><creator>SHI XIYAN</creator><creator>FU XIANZHU</creator><creator>LUO SHILONG</creator><scope>EVB</scope></search><sort><creationdate>20220208</creationdate><title>Chemical copper plating photocuring activated ink and preparation method thereof, and preparation method of addition circuit board</title><author>DING PING ; LIN CHANGLIN ; SHI XIYAN ; FU XIANZHU ; LUO SHILONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114015278A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>DING PING</creatorcontrib><creatorcontrib>LIN CHANGLIN</creatorcontrib><creatorcontrib>SHI XIYAN</creatorcontrib><creatorcontrib>FU XIANZHU</creatorcontrib><creatorcontrib>LUO SHILONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DING PING</au><au>LIN CHANGLIN</au><au>SHI XIYAN</au><au>FU XIANZHU</au><au>LUO SHILONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chemical copper plating photocuring activated ink and preparation method thereof, and preparation method of addition circuit board</title><date>2022-02-08</date><risdate>2022</risdate><abstract>The invention provides chemical copper plating photocuring activated ink and a preparation method thereof, and a preparation method of an addition circuit board, wherein the chemical copper plating photocuring activated ink comprises an organic solvent, and a carbon-supported metal nano composite material, a prepolymer monomer, an active diluent monomer, a photoinitiator and an auxiliary agent dissolved in the organic solvent; the carbon-supported metal nano composite material is composed of carbon black and a metal nano particle catalyst. The chemical copper plating photocuring activated ink prepared by the invention is uniform and stable slurry, and still keeps the original state after being sealed and stored for one month at room temperature; secondly, the chemical copper plating photocuring activated ink can achieve a complete curing effect within several seconds under an ultraviolet lamp illumination condition, so that the production efficiency is greatly improved; finally, the electroless copper-plating</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Chemical copper plating photocuring activated ink and preparation method thereof, and preparation method of addition circuit board |
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