Chemical copper plating photocuring activated ink and preparation method thereof, and preparation method of addition circuit board

The invention provides chemical copper plating photocuring activated ink and a preparation method thereof, and a preparation method of an addition circuit board, wherein the chemical copper plating photocuring activated ink comprises an organic solvent, and a carbon-supported metal nano composite material, a prepolymer monomer, an active diluent monomer, a photoinitiator and an auxiliary agent dissolved in the organic solvent; the carbon-supported metal nano composite material is composed of carbon black and a metal nano particle catalyst. The chemical copper plating photocuring activated ink prepared by the invention is uniform and stable slurry, and still keeps the original state after being sealed and stored for one month at room temperature; secondly, the chemical copper plating photocuring activated ink can achieve a complete curing effect within several seconds under an ultraviolet lamp illumination condition, so that the production efficiency is greatly improved; finally, the electroless copper-plating