Temperature response shape memory epoxy resin, composite material and preparation method

The invention provides temperature response shape memory epoxy resin, a composite material and a preparation method. The composite material comprises the following components: 40-90 parts of hydroxyethylated bisphenol A type epoxy resin and/or hydroxyethylated bisphenol fluorene type epoxy resin and 10-60 parts of a fiber reinforcement. A novel epoxy resin system containing a rigid aromatic ring unit and a flexible ethyoxyl unit is designed and synthesized, a hard segment group and a soft segment group are introduced into an epoxy molecule at the same time, the hard segment is responsible for the mechanical property, and the soft segment is responsible for the shape memory property. The cross-linking density and the molecular chain flexibility of the epoxy resin network are regulated and controlled by changing the proportion of the 'hard segment' and the 'soft segment', so that the transformation temperature range of 80-180 DEG C is regulated and controlled. The fiber reinforcements with different contents ar