Cutting device of silicon rod cutting system and silicon rod cutting system

The embodiment of the invention provides a cutting device of a silicon rod cutting system and the silicon rod cutting system. The cutting device comprises a cutting machine head mechanism, wherein the cutting machine head mechanism comprises a fret saw assembly and a detection assembly, the fret saw...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU KECUN, YANG GUODONG, DAI XINHUI, HAN FAQUAN, SUN PENG, XUE JUNBING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The embodiment of the invention provides a cutting device of a silicon rod cutting system and the silicon rod cutting system. The cutting device comprises a cutting machine head mechanism, wherein the cutting machine head mechanism comprises a fret saw assembly and a detection assembly, the fret saw assembly is provided with a diamond wire, the cutting section of the diamond wire is used for cutting a vertically-arranged silicon rod from top to bottom, and the detection assembly is connected with the fret saw assembly, and is used for detecting the actual cutting curved surface formed after each time of cutting is completed, so that the shape of the actual cutting curved surface is obtained. The silicon rod cutting system comprises the cutting device. According to the detection assembly, the actual cutting curved surface formed after cutting is completed each time can be detected, and a basis is provided for dynamically and accurately adjusting the cutting section in the next cutting process. 本申请实施例提供了一种硅棒切割系