USE OF VACUUM DURING TRANSFER OF SUBSTRATES

A method for evacuating a volume below a substrate in a substrate processing system includes arranging the substrate on a lift mechanism of a substrate support to define the volume below the substrate between the substrate and an upper surface of the substrate support. An evacuation step is initiated to evacuate the volume below the substrate. The evacuation step includes pumping down the volume below the substrate at least one of through and around the lift mechanism. The lift mechanism is lowered during the evacuation step to position the substrate on the upper surface of the substrate support and the evacuation step is terminated. 一种用于抽空衬底处理系统中衬底下方的容积空间的方法包括：将所述衬底布置在衬底支撑件的升降机构上，以将所述衬底下方的容积空间限定在所述衬底与所述衬底支撑件的上表面之间。启动抽空步骤以抽空所述衬底下方的所述容积空间。所述抽空步骤包括经由穿过所述升降机构和围绕所述升降机构中的至少一者抽排所述衬底下方的所述容积空间。在所述抽空步骤期间降低所述升降机构以将所述衬底定位在所述衬底支撑件的上表面上；以及终止所述抽空步骤。