High-purity gold-silver-palladium-platinum alloy bonding wire and preparation method thereof

The invention discloses a high-purity gold-silver-palladium-platinum alloy bonding wire and a preparation method thereof, and relates to the technical field of alloy materials. The high-purity gold-silver-palladium-platinum alloy bonding wire comprises the following components in percentage by weight: 4-7% of gold, 85-94% of silver, 3-4% of palladium and 1-2% of platinum. According to the invention, no matched water cooling needs to be arranged during actual implementation, so that the equipment cost is reduced, waste heat generated in the cooling process can be recycled, the mechanical mixing effect of the first batch of raw materials is more ideal, the time required by the process is further shortened, and more energy conservation and environmental protection are realized while the production efficiency is improved. 本发明公开了一种高纯金银钯铂合金键合引线及其制备方法，涉及到合金材料技术领域，按重量百分比包含金4-7％、银85-94％、钯3-4％以及铂1-2％。本发明在实际实施时无需设置配套水冷，降低设备成本的同时，可以对冷却过程中产生的余热进行回收再利用，使得第一批次原料机械混合效果更加理想的同时并进一步缩短工艺所需时间，提高生产效率的同时更加节能环保。