Single-component solvent-free photovoltaic backboard adhesive and preparation method thereof

The invention discloses a single-component solvent-free photovoltaic backboard adhesive. After hydroxyl-containing polyester polyol is mixed with isocyanate, -OH groups in the polyester polyol and -NCO groups in the isocyanate are subjected to ammonia esterification reaction, and the chain extension...

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Bibliographische Detailangaben
Hauptverfasser:	ZHAO YOUZHONG, WANG QI, ZOU BIN, WEI YANLING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention discloses a single-component solvent-free photovoltaic backboard adhesive. After hydroxyl-containing polyester polyol is mixed with isocyanate, -OH groups in the polyester polyol and -NCO groups in the isocyanate are subjected to ammonia esterification reaction, and the chain extension reaction generates a reticular macromolecular structure, so that a firm bonding layer is formed. The bonding performance, the high temperature resistance, the aging resistance and the weather resistance of the backboard glue are effectively improved. 本发明公开一种单组分无溶剂光伏背板胶黏剂，通过含有羟基的聚酯多元醇与异氰酸酯混合后,聚酯多元醇中的-OH基团与异氰酸酯的-NCO基团发生氨酯化反应,这种扩链反应生成网状高分子结构,从而形成牢固的粘结层。来有效提升背板胶的粘接性能以及耐高温、耐老化和耐候性能。