Light-cured packaging composition, organic packaging film and application thereof

The invention relates to the field of thin film packaging of semiconductor display devices, in particular to a light-cured packaging composition, an organic packaging film and application thereof. The light-cured packaging composition is prepared from, by mass, 5-30% of an epoxy monomer containing a...

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Bibliographische Detailangaben
Hauptverfasser:	HONG HAIBING, SHEN XIN, YANG CHUFENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS
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