Light-cured packaging composition, organic packaging film and application thereof

The invention relates to the field of thin film packaging of semiconductor display devices, in particular to a light-cured packaging composition, an organic packaging film and application thereof. The light-cured packaging composition is prepared from, by mass, 5-30% of an epoxy monomer containing a POSS structure, 20-70% of light-curable epoxy resin, 10-50% of an epoxy diluent and 1-5% of a photoinitiator. The light-cured packaging composition can be used for film packaging of semiconductor display devices, a cured film has the characteristics of high heat resistance, high light transmittance, low curing volume shrinkage and the like, water and oxygen can be effectively blocked, various properties of the devices are effectively stabilized, and the service life of the devices is remarkably prolonged. 本发明涉及半导体显示器件薄膜封装领域，尤其涉及一种光固化封装组合物、有机封装薄膜及其应用，所述光固化封装组合物，按照质量百分数计，包括：含POSS结构的环氧单体5-30％、可光固化的环氧树脂20-70％、环氧稀释剂10-50％以及光引发剂1-5％。所述光固化封装组合物可用于半导体显示器件的薄膜封装，其固化后的薄膜具有高耐热性、高透光率和低固化体积收缩率等特性，能够有效阻隔水和氧气，有效稳定器件的各项性能和显著提升器件的使