Edge grinding device for wafer processing
The invention relates to an edge grinding device for wafer processing, which comprises a base, two fixing columns are symmetrically arranged on the base, a fixing plate is fixedly connected to the other sides of the two fixing plates, a control center is fixedly connected to the lower side of the fi...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to an edge grinding device for wafer processing, which comprises a base, two fixing columns are symmetrically arranged on the base, a fixing plate is fixedly connected to the other sides of the two fixing plates, a control center is fixedly connected to the lower side of the fixing plate, a rotating rod is fixedly connected to the lower side of the control center, a protection plate is arranged on the lower side of the control center, a rotating hole is formed in the upper side of the protection plate, the rotating rod penetrates through the rotating hole, a limiting rod is fixedly connected to the upper side of the protection plate, the other side of the limiting rod is fixedly connected with a fixing plate, a grinding knife is arranged on the inner side of the protection plate, and a through hole is formed in the grinding knife. The rotating rod penetrates through the through hole, a clamping device is arranged on the rotating rod, and a clamping plate is fixedly connected to the upper |
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