Composite heat-conducting PCB

The invention relates to the technical field of circuit boards, in particular to a composite heat conduction PCB. The PCB comprises a circuit board body, a supporting frame is arranged below the circuit board body, clamping columns are arranged on the supporting frame, an air guiding mechanism is installed on the supporting frame, a heat dissipation mechanism is arranged below the air guiding mechanism in a matched mode, a supporting mechanism is installed on the heat dissipation mechanism, the air guiding mechanism comprises an air guiding pipe connected to the supporting frame in a clamped mode, a clamping groove is formed in the side wall of the air guiding pipe, the lower portion of the clamping groove communicates with a limiting groove, and the limiting groove is matched with the clamping column. The heat dissipation mechanism can be supported through the arranged supporting frame, wind energy transmitted by the heat dissipation mechanism can be input into the supporting frame through the arranged wind