Electrical property testing method
The invention provides an electrical property testing method, which can improve the conductivity between an electrical property testing pin and a bonding pad to be tested. The method comprises the following steps: the head of a test pin is soaked into organic liquid, wherein the organic liquid has t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an electrical property testing method, which can improve the conductivity between an electrical property testing pin and a bonding pad to be tested. The method comprises the following steps: the head of a test pin is soaked into organic liquid, wherein the organic liquid has the characteristic of electric conduction after being heated; the head of the test pin attached with the organic liquid is inserted into the bonding pad to be tested; and voltage is applied to the test pin and the bonding pad to be tested, wherein current flows through the test pin, the organic liquid between the test pin and the bonding pad to be tested and the bonding pad to be tested, the organic liquid between the test pin and the bonding pad to be tested is cured, and testing is carried out after curing is completed. By adopting the method disclosed by the embodiment of the invention, the contact resistance between the test pin and the bonding padto be tested can be reduced, and the conductivity between the tes |
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