New energy automobile chip radiator
The invention provides a new energy automobile chip radiator which comprises a mainboard, a chip and a heat dissipation mechanism, the chip is installed on the mainboard, the heat dissipation mechanism comprises a copper plate, a copper pipe, a heat dissipation box, a water storage tank, a water con...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a new energy automobile chip radiator which comprises a mainboard, a chip and a heat dissipation mechanism, the chip is installed on the mainboard, the heat dissipation mechanism comprises a copper plate, a copper pipe, a heat dissipation box, a water storage tank, a water conveying pipe, a water drainage pipe and a heat dissipation fan device, the copper plate abuts against the top of the chip, the copper plate is connected to the mainboard, one end of the copper pipe is connected with the copper plate, the other end of the copper pipe penetrates through the heat dissipation box and then extends into a mounting groove in the heat dissipation fan device, the copper pipe enters the heat dissipation box from the bottom of the heat dissipation box and penetrates out of the heat dissipation box from the side wall of the heat dissipation box, and the heat dissipation fan device is provided with a first grid-shaped air duct opening, a second grid-shaped air duct opening and a cleaning mechani |
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