Array displacement measuring device and method for slope slippage and settlement monitoring

The invention provides an array displacement measuring device and method for slope slippage and settlement monitoring. The device comprises a plurality of steel pipes with pulleys, every two adjacent steel pipes are connected through a flexible joint, and a measuring unit is mounted in each steel pi...

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Bibliographische Detailangaben
Hauptverfasser: ZOU SHUANGCHAO, QUAN LUNIAN, YAO MENGDI, ZHOU FANGFANG, DUAN HANG, ZHANG JIKAI, DU ZEDONG, YU SANDA, REN DACHUN, MAO SUOYING, ZHANG QIAN, ZHANG FENG, HUANG YUEWEN, PENG SIWEI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides an array displacement measuring device and method for slope slippage and settlement monitoring. The device comprises a plurality of steel pipes with pulleys, every two adjacent steel pipes are connected through a flexible joint, and a measuring unit is mounted in each steel pipe; the measuring unit comprises at least two magnetic sensor measuring modules and a magnetic sensor and acceleration sensor measuring module which are mutually communicated in series, the measuring device is arranged in an inclinometer pipe or a settlement pipe of a slope, and a permanent magnet is arranged on the inclinometer pipe or the settlement pipe corresponding to each steel pipe. By integrating the magnetic sensor and the acceleration sensor in the device, the whole device realizes real-time remote monitoring of slope slippage and settlement displacement, so that one measuring device simultaneously realizes measurement of an inclination measuring instrument and a settlement instrument, and the problems of