METHOD FOR MANUFACTURING WATER RESISTANT PRINTED CIRCUIT BOARD

A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a c...

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Bibliographische Detailangaben
Hauptverfasser:	THOMAS WAYNE B, CHU JOHN I, BARBER SHAWN M
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a cleaned substrate. Then, the method proceeds with depositing a multi-layered water resistant coating onto the cleaned substrate. 一种用于制造防水衬底的方法，其包括提供衬底的第一步骤。该方法继续将至少一个部件安置至该衬底上的步骤。接下来，该方法包括清洁包含至少一个部件的衬底以形成清洁衬底的步骤。然后，该方法接着将多层防水涂层沉积至该清洁衬底上。