Semiconductor device

The invention provides a semiconductor device capable of reducing wiring resistance caused by stripe wiring. A semiconductor device (1) includes: a source pad electrode (21) formed on a second interlayer insulating layer (17); a plurality of source extraction electrodes (22) extracted from the sourc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHII YUSUKE, INOUE YUKI, KAZUKI KAWASAKI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a semiconductor device capable of reducing wiring resistance caused by stripe wiring. A semiconductor device (1) includes: a source pad electrode (21) formed on a second interlayer insulating layer (17); a plurality of source extraction electrodes (22) extracted from the source pad electrode (21) in the first direction (X); a drain pad electrode (31) formed on the second interlayer insulating layer (17); and a plurality of drain extraction electrodes (32) extracted from the drain pad electrode (31) in the first direction (X). The source pad electrode (21) and the plurality of source extraction electrodes (22) are electrically connected to the plurality of source wirings (85) of the striped wiring (100) covered by the second interlayer insulating layer (17). The drain pad electrode (31) and the plurality of drain extraction electrodes (32) are electrically connected to the plurality of drain wirings (86) of the stripe wiring (100). The plurality of drain extraction electrodes (32) mesh w