Method for producing cooled power electronics module

The invention relates to a method for producing a cooled power electronics module, comprising the following steps: providing a prefabricated module (14), which comprises a plate-shaped cooling channel cover (12) and at least one electronic component (10) that is integrally bonded and is in thermal contact with an underside of the cooling channel cover (12); 3D-printing a metal swirler structure (16) on the upper side of the cooling channel cover (12) in a region opposite the electronic component (10); and encapsulating the swirler structure (16) in a fluid-conducting housing which is provided with a fluid inlet (181) and a fluid outlet and which is connected to the upper side of the cooling channel cover (12) in a fluid-tight manner. 本发明涉及一种制造冷却的功率电子模块的方法，所述方法包括以下步骤：-提供预制模块(14)，所述预制模块包括板形的冷却通道盖件(12)和至少一个材料接合地并且与冷却通道盖件(12)的下侧热接触地连接的电子部件(10)，-将金属的涡流器结构(16)3D打印在冷却通道盖件(12)的上侧的与电子部件(10)相对置的区域中，并且-将所述涡流器结构(16)封装在流体引导壳体中，所述流体引导壳体设有流体输入端(181)和流体输出端并且与所述冷却通道盖件(12)的上侧流体密封地连接。