MEMS device temperature drift error precision measurement method based on heat conduction analysis

The invention discloses an MEMS device temperature drift error precision measurement method based on heat conduction analysis and belongs to the field of micro-sensing devices. A problem that existing MEMS device temperature drift error measurement based on heat conduction analysis is poor in accuracy is solved, a temperature detection system is adopted to collect the temperature of an MEMS device, the temperature detection system and the MEMS device are both placed in the high-low temperature box, by controlling the temperature change of the high-low temperature box, output data of the MEMS device along with temperature change are obtained, the data outputted by the MEMS device are compared with standard data values of the device at different temperatures, and a temperature drift error is obtained. The method is suitable for precisely measuring the temperature drift error of the MEMS device. 一种基于热传导分析的MEMS器件温漂误差精密测量方法，属于微传感器件领域。本发明解决了现有基于热传导分析的MEMS器件温漂误差测量准确性差的问题，本发明采用温度检测系统对MEMS器件的温度进行采集，并将所述温度检测系统和MEMS器件均放