PASTE ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE

The present invention provides a paste adhesive composition, which is used as a paste adhesive composition of a highly reflective adhesive. The composition includes silver particles, a monomer, and a host. In a cured film obtained by heating the paste-like adhesive composition from 25 DEG C to 175 DEG C for 30 minutes and then curing the paste-like adhesive composition by heat treatment at 175 DEG C for 30 minutes, the reflectance distribution of reflected light generated by incident light incident at an angle of 8 DEG with respect to the plane of the cured film satisfies the following conditions (A), (B) and (C). Condition (A): The reflectance (B) at a wavelength of 430 nm is 45% or more. Condition (B): The reflectance (Y) at a wavelength of 580 nm is 45% or more. Condition (C): The reflectance R at a wavelength of 650 nm is 45% or more. 本发明的糊状粘接剂组合物是用作高反射粘接剂的糊状粘接剂组合物，其包含银颗粒、单体和主剂，通过将该糊状粘接剂组合物经30分钟从温度25℃升温至175℃，再以175℃热处理30分钟使其固化而获得的固化膜中，由相对于固化膜的平面以8°的角度入射的入射光产生的反射光的反射率分布满足以下的条件(A)、条件(B)和条件(C)。条件(A)：对波长430nm的