SOLDER JOINT FAILURE SUPPRESSANT, FLUX, AND SOLDER PASTE

Provided are a solder joint failure suppressant, flux, and solder paste which can suppress the occurrence of joint failure. The flux of the present invention includes a base resin, an activator, a thixotropic agent, a solvent, and a solder joint failure suppressant, and the solder joint failure suppressant includes a compound represented by expression (11) below. In expression (11), R9 and R10 are each independently a saturated or unsaturated linear, branched, or cyclic alkyl group having 1-18 carbon atoms, and R11 and R12 may each independently be carboxy groups or R11 and R12 may be crosslinked to form a carboxylic acid anhydride group. 提供一种可抑制接合不良产生的焊料接合不良抑制剂、焊剂和焊膏。本发明的焊剂包含基体树脂、活化剂、触变剂、溶剂和焊料接合不良抑制剂，所述焊料接合不良抑制剂是包含下述化学式(11)表示的化合物的焊料接合不良抑制剂：在所述化学式(11)中，R9和R10分别独立地是碳原子数为1～18的饱和或不饱和直链、支链或环状烷基，R11和R12分别独立地是羧基，或R11和R12也可以交联形成羧酸酐基。