Braided circuit board and manufacturing method thereof

The invention provides a braided circuit board which comprises a carrier, a wire and an insulated wire, wherein the carrier is made of an insulating material, is in a sheet shape and is provided with a first surface and a second surface; the wire is arranged on the first surface; and the insulated w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHANG GAO, HE JIANGQI, YUAN QIANG, YUE TINGRUI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention provides a braided circuit board which comprises a carrier, a wire and an insulated wire, wherein the carrier is made of an insulating material, is in a sheet shape and is provided with a first surface and a second surface; the wire is arranged on the first surface; and the insulated wire penetrates through the carrier from the second surface, and the insulated wire penetrates through the wire at the first surface, then is bent and penetrates through the carrier to reach the second surface so as to enable the wire to be positioned between the insulated wire and the carrier. The invention also provides a manufacturing method of the braided circuit board, which comprises the steps of sewing the first surface and the second surface of the sheet-shaped carrier made of the insulating material by adopting the insulated wire and the wire; arranging the wire on the first surface of the carrier; enabling the insulated wire to penetrate through the carrier from the second surface to the first surface and