SEMICONDUCTOR PACKAGING SUBSTRATE FINE PITCH METAL BUMP AND REINFORCEMENT STRUCTURES

Semiconductor packaging substrates and processing sequences are described. In an embodiment, a packaging substrate includes a build-up structure, and a patterned metal contact layer partially embedded within the build-up structure and protruding from the build-up structure. The patterned metal contact layer may include an array of surface mount (SMT) metal bumps in a chip mount area, a metal dam structure or combination thereof. 本发明描述了半导体封装基板和处理顺序。在实施方案中，封装基板包括堆积结构和图案化金属接触层，该图案化金属接触层部分地嵌入该堆积结构内并从该堆积结构突出。该图案化金属接触层可包括位于芯片安装区域中的表面安装(SMT)金属凸块阵列、金属围堤结构或它们的组合。