Miniaturized communication module

The invention discloses a miniaturized communication module, which comprises a baseband sub-module, a power management sub-module, a communication sub-module and module pins, and is characterized in that the baseband sub-module comprises a baseband chip used for synthesizing baseband signals; the power management sub-module comprises a hollow heat dissipation plate which is installed on the baseband chip and abuts against the baseband chip, a positioning column which is installed on the side, close to the baseband chip, of the hollow heat dissipation plate, and a metal plate which is installed on the side, away from the hollow heat dissipation plate, of the baseband chip and is provided with a positioning hole, and a positioning adhesive tape which is attached to one side, far away from the baseband chip, of the metal plate and abuts against the positioning column. The heat dissipation device has the effect of improving the heat dissipation performance. 本申请公开了一种小型化通讯模块，其包括基带子模块、电源管理子模块、通信子模块以及模块引脚，基带子模块包括用于合成