SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD FOR FABRICATING THE SAME

A method for fabricating a semiconductor device with a heterogeneous solder joint includes: providing a semiconductor die; providing a coupled element; and soldering the semiconductor die to the coupled element with a first solder joint. The first solder joint includes: a solder material including a first metal composition; and a coating including a second metal composition, different from the first metal composition, the coating at least partially covering the solder material. The second metal composition has a greater stiffness and/or a higher melting point than the first metal composition. 一种用于制造具有异质焊接接合部的半导体器件的方法包括：提供半导体裸片，提供耦合元件，以及用第一焊接接合部将半导体裸片焊接到耦合元件，第一焊接接合部包括：包括第一金属成分的焊料材料以及包括不同于第一金属成分的第二金属成分的涂层，所述涂层至少部分地覆盖焊料材料，其中，第二金属成分比第一金属成分具有更大的刚度和/或更高的熔点。