METHOD FOR FORMING METAL PATTERN
The present invention relates to a method for forming a metal pattern at a pattern formation section set on a base material. In the present invention, a substrate is used which is provided with a fluorine-containing resin layer on a base material surface that includes the abovementioned pattern form...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention relates to a method for forming a metal pattern at a pattern formation section set on a base material. In the present invention, a substrate is used which is provided with a fluorine-containing resin layer on a base material surface that includes the abovementioned pattern formation section. The method for forming a metal pattern according to the present invention includes: a step for forming a functional group at the pattern formation section; and a step for applying, to the base material surface, a metal ink having, as a protective agent, an amine compound and a fatty acid, and affixing metal particles to the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy of at least 13 mN/m and no more than 20 mN/m, as measured using the Owens-Wendt method, is applied as the fluorine-containing resin layer. Furthermore, a metal ink which includes ethylcellulose as an additive is applied as the abovementioned metal ink.
本发明涉及在设定于基材上的图案形成部形成 |
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