Power module and method for packaging power module

Power module and method for packaging power module

The invention discloses a power module and a method for packaging the power module, and belongs to the technical field of electronic power devices. The power module comprises a frame, the frame being provided with a conductive first installation area, a conductive second installation area and a plur...

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Hauptverfasser: YAN QUANFENG, QU HAO, SONG MENG'EN, ZHANG YAN, FANG MINGZHAN, LEI LONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YAN QUANFENG
QU HAO
SONG MENG'EN
ZHANG YAN
FANG MINGZHAN
LEI LONG
description The invention discloses a power module and a method for packaging the power module, and belongs to the technical field of electronic power devices. The power module comprises a frame, the frame being provided with a conductive first installation area, a conductive second installation area and a plurality of pins, the plurality of pins comprising a cathode pin, a collector pin, an emitter pin and a gate pin, the first installation area being electrically connected with the cathode pin, and the second mounting area being electrically connected with the collector pin; a diode unit, arranged in the first mounting area, the cathode of the diode unit being electrically connected with the first mounting area, and the anode of the diode unit being electrically connected with the collector pin; an IGBT unit, the IGBT unit being arranged in the second installation area, a collector electrode of the IGBT unit being electrically connected with the second installation area, an emitting electrode of the IGBT unit being ele
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Power module and method for packaging power module
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