Power module and method for packaging power module

The invention discloses a power module and a method for packaging the power module, and belongs to the technical field of electronic power devices. The power module comprises a frame, the frame being provided with a conductive first installation area, a conductive second installation area and a plurality of pins, the plurality of pins comprising a cathode pin, a collector pin, an emitter pin and a gate pin, the first installation area being electrically connected with the cathode pin, and the second mounting area being electrically connected with the collector pin; a diode unit, arranged in the first mounting area, the cathode of the diode unit being electrically connected with the first mounting area, and the anode of the diode unit being electrically connected with the collector pin; an IGBT unit, the IGBT unit being arranged in the second installation area, a collector electrode of the IGBT unit being electrically connected with the second installation area, an emitting electrode of the IGBT unit being ele